In the fields of precision manufacturing and industrial maintenance, critical defects often lurk within sub-millimeter gaps. Traditional endoscopic tools frequently fall short in these extreme scenarios due to excessive diameter or inadequate lighting. To address this, we present a 1.05mm diameter USB UVC endoscope camera module based on the OmniVision OCHFA20 sensor, designed to provide professionals with a reliable, high-definition, and easily integrated direct visual inspection tool.
Ultra-Slim Diameter and Separate Lighting: The 1.05mm lens diameter is the foundation for accessing ultra-narrow spaces. More critically, its Separate LED design—where the light source is independently positioned from the lens via flexible wiring—delivers two decisive advantages:
Optimized Thermal Management: Heat generated by the LEDs is effectively isolated from the core imaging components, ensuring stable long-term operation of the CMOS sensor and preventing increased image noise due to temperature rise.
Lighting Flexibility: The angle and position of the light source can be flexibly adjusted, providing side or grazing illumination for deep hole sidewalls or the back of complex structures. This significantly reduces glare on reflective surfaces like metal and highlights topographical defects such as cracks and scratches.
Stable Imaging and Plug-and-Play Integration: The equipped OCHFA20 sensor (1/18 inch, 1.008μm pixel) delivers clear 720P@30fps images even in low-light conditions. Its full support for the UVC protocol means it is recognized without dedicated drivers by mainstream operating systems like Windows, Linux, and macOS, enabling true plug-and-play functionality via a Type-C interface. This greatly reduces the barrier and time cost for system integration and development.
Industrial-Grade Reliability and Compliance: The module is manufactured using SMT processes and AA (Active Alignment) production techniques, ensuring consistency and long-term reliability. It has also passed multiple international certifications such as CE, FCC, and RoHS, meeting the safety and environmental requirements of industrial applications.
Extremely Limited Spaces: Inspecting micro-holes (approx. >1.1mm diameter), precision gear clearances, narrow pipelines, or gaps within densely packed electronic components.
Surface Feature Inspection: Detecting scratches or micro-cracks on highly reflective surfaces (e.g., polished metal, solder joints) where side lighting is needed to eliminate glare.
Prolonged or Online Inspection: Tasks requiring the probe to operate continuously for extended periods, demanding high thermal stability.
Rapid Integration and Deployment: Quickly adding visual functionality to existing inspection equipment or mobile terminals, requiring plug-and-play operation without complex driver development.
Very High-Resolution Requirements: If inspection needs detail beyond what 0.5MP (720P) resolution provides, a higher-pixel sensor solution may be necessary.
Need for Autofocus: The module features manual focus. If the inspection distance changes frequently and requires rapid capture, fixed or manual focus may impact efficiency.
Extreme Cost Sensitivity for One-Time Use: For simple, one-time, or very low-frequency checks, the cost of this professional module may be higher than some simpler alternatives.
In summary, this module is a professional tool optimized to solve specific physical access and imaging challenges. Its value lies in achieving superior imaging reliability and flexibility compared to traditional integrated designs within an ultra-slim diameter, thanks to features like Separate lighting. It is a practical choice for high-end industrial inspection, precision equipment maintenance, and complex system fault diagnosis.
