FPC Selection from the Manufacturing End—The Triangular Balance of Cost, Process, and Testing
July 8, 2025
Based on the mass production needs of camera module manufacturers, FPC selection must consider three manufacturing dimensions:
Process Compatibility:
COB Packaging: Must withstand reflow soldering temperatures of 250°C to prevent substrate delamination.
Laser Drilling Precision: Requires a precision of ≤50μm to match the 0.4mm pitch of BTB connectors.
Testing Cost-effectiveness:
Pogo Pin Module Testing: A pogo pin module testing solution can reduce probe replacement frequency (with a lifespan >200,000 cycles).
Daisy Chain Test Circuit Design: It is recommended to use a daisy chain test circuit design to improve AOI inspection efficiency by 30%.
Supply Chain Resilience:
Dual Supplier Strategy: Under a dual supplier strategy, the impedance tolerance of FPC must be strictly aligned (ΔZ < 5Ω).
LCP Substrate Capability: Prioritize manufacturers with the capability to supply LCP substrates (with a dielectric constant Dk ≤ 2.9).
Innovation Trends: 5G Millimeter-Wave Band: The 5G millimeter-wave band is driving FPCs towards a "sandwich" structure, using a design with two layers of PI film sandwiching copper foil, reducing insertion loss by 40% at 28GHz.
