Gcore's 32MP and 50MP image sensor shipments have exceeded 100 million units year-to-date as of December 5, 2025, with high-pixel products commanding an increasing share of mobile CIS revenue.
For camera module manufacturers, the milestone signals proven supply chain stability and manufacturing scalability. The 50MP portfolio spans multiple pixel specifications—0.61μm, 0.7μm, and 1.0μm—enabling flexible design choices across primary, ultra-wide, and front-facing camera modules for various smartphone tiers.
The company recently secured ODM orders from an international brand for its second-generation 0.7μm 50MP sensor, with shipments already underway. This adoption by tier-one OEMs validates the maturity of Gcore's single-chip integration technology, which eliminates multi-die packaging complexity and reduces module Z-height—a critical consideration for slim smartphone designs.
With continued volume ramp and established fab-lite manufacturing, Gcore offers module partners a reliable source of high-pixel sensors optimized for mainstream camera applications
