On September 29, 2025, Sony Semiconductor Solutions Corporation officially launched the IMX927, a stacked CMOS image sensor tailored for the industrial inspection sector, alongside 7 variants of the same product series with distinct features. Through dual breakthroughs in high pixel count and high-speed imaging, this sensor redefines the performance standards for machine vision inspection. Its release not only addresses the urgent demand for precision inspection in factory automation but also clearly outlines the technological evolution path of industrial inspection cameras.
Core Specification Table for IMX927 and Its Series Products
|
Specification Category |
Detailed Specifications |
|
Sensor Type |
Stacked Backside-Illuminated (BSI) Global Shutter CMOS |
|
Effective Pixels |
IMX927: Approximately 105 million pixels; Series includes 24.55 million, 12.41 million pixels, etc. |
|
Maximum Frame Rate |
IMX927: 100fps (10-bit output); High-resolution models in the series reach 394fps |
|
Pixel Size |
2.74μm (adopting Pregius S™ pixel structure) |
|
Sensor Size |
IMX927: 28.1mm×28.1mm |
|
Core Packaging Technology |
Ceramic packaging with connector (supports 8 product models, detachable for replacement) |
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Key Features |
Low-noise imaging, no dynamic distortion, 1-shot HDR function, multi-mode pixel binning readout |
|
Mass Production Time |
Mid-November 2025 |
The technological innovations of the IMX927 focus on three key dimensions. In terms of imaging performance, it is equipped with Sony's self-developed Pregius S™ global shutter technology. Through the 2.74μm backside-illuminated micro-pixel design, it achieves 100-million-level high resolution while maintaining high sensitivity and high saturation capacity, completely resolving the issue of dynamic distortion in imaging of high-speed moving objects. Even micron-level defects on semiconductor wafers can be clearly captured.
Its high-speed processing capability is equally impressive: by optimizing the circuit structure for pixel readout and A/D conversion, it achieves power consumption optimization under 100fps high-speed output, with efficiency nearly doubled compared to previous-generation products, significantly shortening the inspection cycle of production lines. The newly developed ceramic packaging with a connector is a targeted design for industrial scenarios—it not only supports quick detachment and replacement of the sensor but also offers excellent heat dissipation performance, ensuring stable long-term operation of the equipment.
The technical layout of the IMX927 series accurately aligns with the upgrading needs of industrial automation, driving the evolution of inspection cameras in the following directions:
Synergy of Ultra-High Definition and High-Speed Imaging: Traditional industrial cameras often face the dilemma of "sacrificing frame rate for high resolution." However, the IMX927’s combination of 105 million pixels and 100fps verifies the feasibility of "dual-high" synergy. In the future, cameras will generally achieve a performance combination of over 20 million pixels + 200fps, which not only meets the precision inspection needs of new energy battery electrodes and semiconductor chips but also adapts to high-speed assembly line batch inspection scenarios.
Enhanced Multi-Scenario Adaptability of Single Chips: Sony’s strategy of launching 8 differentiated models simultaneously reflects the industry’s demand for "one device, multiple functions." In the future, cameras will realize flexible adaptation to scenarios such as "high-precision measurement," "high-speed recognition," and "low-light imaging" through switchable pixel binning modes (2×2, 2×1, etc.), sub-sampling, and full-pixel switching functions, reducing equipment investment costs for production lines.
Upgraded Modularization and Maintenance Convenience: The ceramic packaging technology with a connector breaks the fixed binding between the sensor and the module, promoting the development of cameras toward "modular design." In the future, industrial cameras will enable quick replacement of sensors, lenses, and interfaces, reducing equipment maintenance time from hours to minutes and significantly lowering factory downtime losses.
Deepened 3D Inspection and Visual Fusion: The high frame rate of the IMX927 is already compatible with 3D inspection technologies such as the light section method and structured light method. In the future, cameras will further integrate depth sensing capabilities to simultaneously perform 2D defect detection and 3D dimension measurement. Meanwhile, the application of multi-spectral fusion technology will solve the inspection challenges of high-contrast materials such as black rubber and metals.
Breakthroughs in sensor performance place higher demands on module integration, requiring simultaneous upgrades in optics, hardware, reliability, and other dimensions:
Optical Systems Adapted to High-Pixel and High-Speed Needs: High-resolution lenses with distortion rate ≤0.5% must be used to match the 105-million-pixel imaging accuracy; the light transmittance of lenses must reach a large aperture of F1.4 or above to ensure low-noise imaging. At the same time, lenses should support industrial universal standards such as C-mount to reduce system integration costs.
Hardware Integration Meeting High-Speed and Low-Power Needs: High-speed interfaces such as SLVS-EC 12.5Gbps/lane or above must be adopted to ensure delay-free transmission of 100fps data; through optimizing power management and signal processing circuits, the overall power consumption of the module should be controlled within 2W to meet the low-power requirements of industrial equipment. The packaging should use ceramic or metal materials with excellent heat dissipation performance to suppress heat generation during long-term operation.
Reliability Adapted to Harsh Industrial Environments: The operating temperature range should cover -40℃~85℃, and pass the 1000-hour high-temperature and high-humidity (85℃/85%RH) test; the protection level should reach IP67 or above to resist erosion by dust, oil, and cooling fluids. At the same time, it must pass the CISPR 25 electromagnetic interference resistance certification to avoid signal conflicts with other equipment on the production line.
Optimized Software and Algorithm Compatibility: Modules should provide open SDK interfaces to support connection with mainstream machine vision algorithm platforms; built-in preprocessing functions such as distortion correction and HDR synthesis to reduce the load on backend processors. For 3D inspection scenarios, they should support synchronous triggering with laser projectors to ensure precise coordination between image acquisition and light source control.
The launch of the IMX927 marks the entry of industrial inspection cameras into a new era of "high pixel count, high speed, and high adaptability." With the deep integration of sensor technology and module integration, industrial inspection will achieve the leap from "manual assistance" to "full automation" in the future, providing more precise and efficient visual perception support for smart manufacturing. Moreover, the technological directions of modularization, low power consumption, and strong compatibility will also promote the popularization of industrial vision equipment in small and medium-sized enterprises.