13mp Samsung CMOS Image Sensor S5K3L6 Mipi Camera Module For Scanning
Specificaitons
| Image Sensor | 1/3.06’’ S5K3L6XX03-FGX9 |
| Pixel Size | 1.12μm(H) x 1.12μm(V) |
| Resolution | 13 Megapixel 4224H x 3136V |
| Interface | 30pin MIPI |
| FOV | 82° |
| Focus Type | Auto Focus |
| Objective Distance | 10cm to Infinity |
| Shutter Type | Rolling Shutter |
| Focal Length | 3.65mm |
| AVDD | 2.8V |
Description
S5K3L6 is a highly integrated 13M pixel camera chip that includes a CMOS image sensor (CIS), image correction functionality and serial transmission using 4-lane MIPI. It is fabricated using SAMSUNG CMOS image sensor process developed for imaging applications to realize a high-efficiency and low-power photo sensor. The sensor consists of 4208 × 3120 effective pixels (4224 × 3136 active pixels) that matches the 1/3-inch optical format.
The CIS has on-chip 10-bit ADC arrays to digitize the pixel output and on-chip Correlated Double Sampling (CDS
to reduce Fixed Pattern Noise(FPN) drastically.It incorporates on-chip camera functions such as data binning.
data formatting.
S5K3L6 is suitable for low power camera module with2.8V/1.05 V power supply.
Features
◆13Mp sensor with 1/3" optics
◆Unit Pixel Size : 1.12 μm x 1.12 um
◆Effective Resolution : 4208 (H) × 3120 (V) pixels
◆Active Resolution : 4224 (H) × 3136 (V) pixels
◆Color Filter : RGB Bayer Pattern
◆Shutter Type : Electronic Rolling Shutter and global reset
◆Max. Normal Frame Rate : 30 fps @ Full
◆Max. Video Frame Rate : 60 fps @ FHD, 120fps @ HD
◆Data rate : 1.25 Gbps/lane
◆ADC Accuracy : 10 bits
◆Interfaces : MIPI CSI-2 (1.25 Gbps per lane, 4 lanes) Output formats - RAW8 (truncated), RAW10
◆Control interface : I2C-compatible / 2'nd I2C Slave address support for Dual camera
◆3.5 Kbits of On-chip OTP memory for users
◆Analog gain x16
◆Vertical Flip and Horizontal Mirror mode
◆Average-sub-sampling - 2/2
◆Bad Pixel Correction
◆Built-in test pattern generation
◆Supply voltage : 2.8 V for analog, 1.8 V or 2.8 V for I/O, and 1.05 V for digital core supply
◆Operating temperature : –30 ℃ to + 70 ℃
◆Backside illumination(BSI) structure
Applicaitons
Barcode Scanning
3D Scanning
Virtual/Augmented Reality
Positional Tracking
Gesture Recognition
Machine Vision
Biometric Scanning
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